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Can an adhesive maintain its strength when bonding titanium to carbon-carbon composites under extreme temperature and harsh conditions?
Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm.
Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill.
Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry.