Master Bond Inc.

+1-201-343-8983http://www.masterbond.com

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Epoxies

Epoxies are the most widely used polymeric materials for adhesives, sealants, coatings, potting/encapsulation compounds and impregnants. Desirable properties include high bond strength to a wide variety of different substrates, outstanding gap filling capabilities, excellent electrical insulation and high chemical inertness. Epoxies may be formulated as one part or two part.

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Other Key Performance Properties

  • Abrasion Resistance
  • Dimensional Stability
  • High Peel Strength
  • High Shear Strength
  • Flexibilized and Toughened
  • Vibration Shock and Impact Resistance
  • Low Stress
  • Spectral Transmittance

Certifications for Certain Grades of One and Two Component Epoxy Adhesives, Sealants, Coatings and Potting Compounds

  • NASA low outgassing
  • USP Class VI for biocompatibility
  • FDA CFR 175.300 for food applications
  • UL94V-0 specification for flame retardancy
  • Halogen free

Recent Product Developments

EP62-1LPSP is a two component, high performance epoxy system featuring convenient handling along with excellent temperature and chemical resistance. Read more.

Supreme 12AOHT-LO is a one part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing that also meets NASA low outgassing specifications. Read more.

Sealants and Coatings

Master Bond manufactures specialty coatings and sealants for use in advanced technology applications. These materials include:

  • Epoxies
  • Polyurethanes
  • Silicones
  • Polysulfides
  • Composite Materials

Potting and Encapsulation Compounds

Master Bond's high performance potting and encapsulation compounds have been formulated to meet the stringent demands of the electrical and electronic industries. Applications vary from relays, connectors and power supplies to surge suppressors and telecommunication equipment. The most noteworthy characteristics of these products are:

  • High Voltage Insulation
  • Low Viscosity
  • Cryogenic Serviceability
  • Low Coefficients of Thermal Expansion

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