Toughened System with Very Low Exotherm
Designed for bonding, coating, sealing and encapsulating, Master Bond EP21FL has a low viscosity and cures at room temperature. It is a toughened epoxy that is ideal for bonding dissimilar substrates with differing coefficients of expansion.
EP21FL is effective for bonding surfaces subjected to rigorous thermal cycling and mechanical shock.
For more information, request a technical data sheet on EP21FL.