Master Bond Inc.

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Max Gets All Charged Up With Epoxies for Electronics

Max powers up his technical expertise on Master Bond’s adhesives, sealants and coatings for electronic applications.

In this latest feature, he explains how our epoxies can be used for heat sink assembly, conformal coatings, surface mount connection, glob top encapsulants, flip chip underfills and more.

For more information please visit: http://www.masterbond.com/mb-video/max-gets-all-charged-epoxies-electronics

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