Master Bond Inc.


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Thermally Conductive Epoxy Meets NASA Low Outgassing Specs

EP21TDC-2LO is a room temperature curing, flexibilized adhesive, sealant and encapsulant. This unique compound has superior shear and peel strength properties. It has an elongation of greater than 25% at 75°F and a Shore D hardness of 36. It offers remarkable resistance to chemicals, thermal shock and impact.

The hardened system is an excellent electrical insulator.

For more information, request a technical data sheet on EP21TDC-2LO.

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