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Omni offer the following technologies along with associated equipment and process support: Ion Beam Deposition (IBD), Ion Beam Etching (IBE), Atomic Layer Deposition (ALD), Magnetrons, Sputter Process Control, E-Beam Resist (EBR), Microelectronics ink jet printing, Rapid Thermal Processing (RTP), Physical Vapour Deposition (PVD), Scribing and Cleaving, Vacuum Gas Monitoring, Plasma Etch, Plasma Enhanced Chemical Vapour Deposition (PECVD), Microwave Ashing and Surface Cleaning, Electrochemical Deposition (ECD, Parylene Deposition.)

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