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New Benchmark in High-Speed Thermal Imaging

FLIR Systems has introduced a strained layer superlattice (SLS) detector version of its X6900sc camera

FLIR Systems has introduced a strained layer superlattice (SLS) detector version of its X6900sc camera that raises the bar on high-speed thermal imaging. The FLIR X6900sc SLS thermal camera captures full-frame 640x512 thermal images at over 1000 frames per second and at temperatures up to 3000 degrees Celsius. This advanced technology is combined with popular features of high-speed visible cameras, such as remote triggering and precise synchronization, to produce a high-performance camera that can capture meaningful thermal data for anything from ballistics and aerospace research to composite materials testing.

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What’s new

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    Thermal Imaging Assists Sports and Exercise Science Research

    News | 26 Sep 2017

    The Department of Sport and Exercise Science at Portsmouth University, UK reports on the advantages of using FLIR Systems thermal imaging cameras for measuring skin temperature at rest, during exercise, and recovery.

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    Training Videos for CBRNE Professionals

    News | 19 Sep 2017

    FLIR Systems announces a new and highly informative CBRNE (Chemical, Biological, Radiological, Nuclear, and Explosive materials) training video series - FLIR PRIMED.

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    New Benchmark in High-Speed Thermal Imaging

    News | 29 Aug 2017

    FLIR Systems has introduced a strained layer superlattice (SLS) detector version of its X6900sc camera

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    Thermal Imaging Assists Surgical Procedures

    News | 22 Aug 2017

    FLIR Systems has published an applications article that describes how a leading US university has been using a FLIR A655sc thermal imaging camera to study the effect of temperature on tissue autofluorescence.

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    Thermal Imaging Speeds Up Repair of Printed Circuit Boards

    News | 20 Jul 2017

    FLIR Systems has published an application note that describes how their ETS320 thermal imaging camera is being used by ISOMEDIA GmbH (Stuttgart, Germany) to investigate and speed-up the repair of assembled printed circuit boards (PBA).

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