Oxford Instruments Plasma Technology offers flexible etch, deposition and growth process tools and leading-edge processes for the engineering of semiconductor structures and devices.
Our systems provide solutions for precise materials deposition, etching of nanometre-sized features and controlled growth of nanostructures, based on core technologies.
- Plasma Etch & Deposition
- Atomic Layer Deposition (ALD)
- Ion Beam Etch & Deposition
- Deep Silicon Etch
- Physical Vapour Deposition
We offer an extensive process library of over 6,000 recipes developed in our process laboratories in the UK and Taiwan. Our processes are backed by process guarantees for key properties and repeatability such as rate and uniformity to ensure rapid start-up during installation.
- Compound Semi processes
- Micro/Nano applications
- Si front-end processes
- Si back-end processes
We’re excited to launch the MoS2 growth process using our high performance Nanofab® nanoscale growth system.
“Low temperature plasma-assisted ALD of conductive films” will be presented by Brodie Mackenzie, September 28, 2015 at 10.25
Webinar presented by Dr Andrey V Kretinin (University of Manchester, UK), Dr Ravi Sundaram (Oxford Instruments, UK) and Dr A A Bol (Eindhoven University of Technology, Netherlands)
Webinar presented by Deirdre Olynick (Lawrence Berkeley National Laboratory) and Kim Lee (Seagate)
Now available for iPhone and iPad: Oxford Instruments Plasma Technology periodic table App for plasma etch & deposition processing
Oxford Instruments Plasma Technology’s newly updated App for iPhone allows the user to look up process chemistries in order to etch or deposit any material through an easy periodic table interface.