Master Bond Inc.


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Top 6 Adhesives for Heat Transfer

Featuring ultra fine filler particles & low thermal resistance


For applications where thermal conductivity is essential, Master Bond offers a variety of adhesive systems that include special fillers to enhance this property and can be applied in thin bond lines. Select formulations also deliver exceptionally low thermal resistance. Our thermally conductive compounds also feature wide service temperature ranges, excellent electrical properties and high strength values. Some of our standout adhesives for heat transfer are now available in an easy to browse digital brochure.

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