KJLC® Awarded a Patent for Its Atomic Layer Deposition System and Process

The Kurt J. Lesker Company® (KJLC®) recently announced that the United States Patent and Trademark Office has issued a US patent covering the design of an atomic layer deposition system and the process to use that system to deposit highly precise and conformal thin films. 

The Kurt J. Lesker Company® (KJLC®), a global manufacturer of vacuum systems, thin film deposition tools and vacuum components, recently announced that the United States Patent and Trademark Office has issued US patent number 9,695,510, 'Atomic Layer Deposition Apparatus and Process', covering the design of an atomic layer deposition system and the process to use that system to deposit highly precise and conformal thin films.

This proprietary technology substantially reduces the interaction of various precursor gas molecules with the internal surfaces of the reaction chamber and enables actual focusing of gas streams to more effectively coat the surface of arbitrarily large substrates. 

For more information see this blog on our Blog page:  www.lesker.com/newweb/blog/.

What’s new

Search all our content