Master Bond manufactures innovative, technologically advanced adhesives, sealants, coatings and potting/encapsulation compounds designed to meet specific application requirements.
Master Bond offers the widest selection of adhesive compounds for cutting edge bonding applications. The key advantages of using Master Bond products are:
- Over 3,000 grades to choose from
- Job proven performance for more than 30 years
Reliable bonding for a wide variety of substrates, including but not limited to:
Sealants and Coatings
Master Bond manufactures specialty coatings and sealants for use in advanced technology applications. These materials include:
- Composite Materials
Potting and Encapsulation Compounds
Master Bond's high performance potting and encapsulation compounds have been formulated to meet the stringent demands of the electrical and electronic industries. Applications vary from relays, connectors and power supplies to surge suppressors and telecommunication equipment. The most noteworthy characteristics of these products are:
- High Voltage Insulation
- Low Viscosity
- Cryogenic Serviceability
- Low Coefficients of Thermal Expansion
Can an adhesive maintain its strength when bonding titanium to carbon-carbon composites under extreme temperature and harsh conditions?
Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm.
Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill.
Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry.